Research & Development
PRP’s Research Department is continually developing coolant formulations for cutting sapphire & solar silicon wafers with diamond coated wire. This research effort has been enhanced by the recent acquisition of a state of the art Takatori multi-wire saw, which enables direct evaluation of how coolant properties influence cut wafer characteristics such as warp, bow and total thickness variation. Additionally, our R&D Lab is equipped with a Hamai 9BF lapping machine, a Crest ultrasonic cleaning system and a DrM TSD bench top filter system to complement research on wafer lapping vehicles, cleaners and diamond wire coolants.
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Cleaning - 156 mm mono silicon wafers, Ultraclean PFS
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Cut Wafers
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Lapping
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Electroplated diamond wire for silicon slicing
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Diamond Wire Saw - 156 mm mono silicon, Aquaslice at 2%
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Lapping and Wiresaw
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Diamond Wire Saw - 4-inch C-plane sapphire, Procut 50 at 5%
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Benchtop candle type filtration system
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IC Diamond Wire Slicing with AquaSlice