PRP’s Research Department is continually developing coolant formulations for cutting sapphire & solar silicon wafers with diamond coated wire. This research effort has been enhanced by the recent acquisition of a state of the art Takatori multi-wire saw, which enables direct evaluation of how coolant properties influence cut wafer characteristics such as warp, bow and total thickness variation. Additionally, our R&D Lab is equipped with a Hamai 9BF lapping machine, a Crest ultrasonic cleaning system and a DrM TSD bench top filter system to complement research on wafer lapping vehicles, cleaners and diamond wire coolants.