PRP UltraClean

Process Research Products has developed a unique ultrasonic cleaner that solves a common defect faced after lapping by IC wafer manufactures worldwide.  “Grid Marks” are encountered at the end of the lapping cycle when used slurry dries on the wafer surface leaving a grid of the lapping plate on the wafer surface.  Our breakthrough product ULTRACLEAN PFS eliminates this defect when used in ultrasonic cleaning baths after lapping.