SAPPHIRE, SILICON CARBIDE
These very hard materials can be cut on wire saw machines. Some customers cut wafers by traditional methods using low viscosity SILCUT suspension oil mixed into a slurry with diamond abrasive.
A more recent innovation is to cut the wafers with electroplated, diamond coated wire on a wire saw machine. For this operation, we recommend our water based surfactant/coolant PROCUT.
The lapping process uses AQUALAP synthetic gel usually mixed with diamond powder, but for lapping sapphire, boron carbide (B4C) abrasive can be used. Some AQUALAPS can be recirculated to help achieve cost savings. Process Research also manufactures a range of ULTRACLEAN alkaline & neutral cleaners for cleaning wafers in ultrasonic baths.