The ingot is sliced into thin wafers using a
10-tonne wire saw. The basic principle of wire sawing is to feed the ingot into
a web of ultra-thin, fast moving wire. The cutting action of the wire is created
by dispensing an abrasive slurry over the web while the wire is transported in a
rapid, back and forth lateral motion. The wire web is, in effect, a single wire
being fed from one large spool to another. Depending on the wire diameter, each
spool can hold hundreds of kilometers of wire. The wire saw technology allows
for the entire ingot to be sliced simultaneously, thus, lowering cycle time and
minimizing "kerf" loss.
SILCUT
The above technology has enabled PRP to use suspension technology developed over
many years to formulate “Silcut” wire saw carrier fluids. “Silcut” wire saw
vehicles are available in a wide range of viscosities both in oil and glycol.
Silcut fluids are suitable for wire sawing silicon wafers when made into a
slurry using silicon carbide abrasive.
OIL-BASED WIRE SAW SLICING FLUID
PRODUCT DESCRIPTION
PROCESS RESEARCH PRODUCTS has successfully developed a series of oil based wire
saw slicing fluids for slicing silicon, silicon carbide, quartz, sapphire, and
other electronic semiconductor materials. All products have been designed with
excellent suspension properties. SILCUT products are designed is for use on NTC,
Hauser, Meyer & Berger saws, and Themis.
PRODUCT BENEFITS/FEATURES:
Excellent thermal stability
Excellent suspension stability with GC 1000, 1200 & 1500 abrasive
Stable viscosity during use
Long slurry life and low replenishment
Easily cleaned
Good lubricity
Water soluble
Easily cleaned (non-staining)
Biodegradable and easy to dispose
GLYCOL BASED SILCUT
SYNTHETIC FLUID FOR WIRE SAWING
PRODUCT DESCRIPTION: PROCESS RESEARCH PRODUCTS has developed a range of proven synthetic wire saw
slicing fluids for the cutting of silicon wafers. These products are developed
specifically for each brand of wire saws. Various abrasives can be mixed with
SILCUT to form a slurry. Typical abrasives are silicon carbide (GC). SILCUT is
used in conjunction with Silicon Carbide typically GC 1000, 1200 or GC 1500.
SILCUT, when mixed thoroughly with silicon carbide, produces a soft-settling
glycol based slurry.
CLEANING
A complete and proven range of water-based cleaners
from low pH to high pH for the cleaning of MOS wafers and many other electronic
and ceramic parts. Ultraclean is especially designed for use in ultrasonic
baths. Some Ultracleans are also suitable for spray applications. All Ultraclean
is manufactured to semiconductor standards.
PRODUCT BENEFITS/FEATURES:
•Ultraclean is typically used at 4% in water.
•Ultraclean works more effectively when used in ultrasonic cleaning baths.
•Ultrasonic baths should be heated to 60 degrees Celsius as a starting point.
•Ultraclean products are biodegradable.
•Ultraclean products have excellent rinsing characteristics.
•Ultralcean products have high reserve alkalinity for long shelf life.
The ingot is sliced into thin wafers using a
10-tonne wire saw. The basic principle of wire sawing is to feed the ingot into
a web of ultra-thin, fast moving wire. The cutting action of the wire is created
by dispensing an abrasive slurry over the web while the wire is transported in a
rapid, back and forth lateral motion. The wire web is, in effect, a single wire
being fed from one large spool to another. Depending on the wire diameter, each
spool can hold hundreds of kilometers of wire. The wire saw technology allows
for the entire ingot to be sliced simultaneously, thus, lowering cycle time and
minimizing "kerf" loss.
CLEANING